-40%

Copper Metal Thin Sheet Foil Plate Shim Thick 0.2mm/0.5mm/0.8mm/1mm 100X100mm

$ 2.02

Availability: 19 in stock
  • All returns accepted: Returns Accepted
  • MPN: Does not apply
  • UPC: Does not apply
  • Refund will be given as: Money back or replacement (buyer's choice)
  • Condition: New
  • Item must be returned within: 30 Days
  • EAN: Does not apply
  • Return shipping will be paid by: Buyer
  • Brand: Unbranded
  • Restocking Fee: No

    Description

    Copper Metal Thin Sheet Foil Plate Shim Thick 0.2mm/0.5mm/0.8mm/1mm 100X100mm
    Specifications
    Color:
    Copper
    Material: Copper
    Size:100mmx100mm
    ( thickness 0.1/0.2/0.5/0.8/1mm based on your choice)
    Feature:
    -100% new and high quality.
    -Smooth surface, smooth edges and corners, no burr.
    -Has good electrical conductivity, thermal conductivity, corrosion resistance and processing properties, can be welded and brazing.
    -To improve the thermal conductivity of filler, applies to the graphics card and radiating module and conduction gap, reduce the repair rate card.
    -Applications: mobile phone, tablet, notebook CPU chip, North and South Bridge chip, memory chip, memory chips and card small chip, small chip hard all kinds of computer electronic chip auxiliary heat.
    Usage method:
    -Clean electronic components surface, to ensure that no greasy no debris, keep the surface dry, then tear to heat sink on the back of the built-in protective film, the heat sink careful viscosity on heat chip, slightly to ensure uniform force can be.
    Copper Metal Thin Sheet Foil Plate Shim Thick 0.2mm/0.5mm/0.8mm/1mm 100X100mm
    Description
    Specifications
    Color:
    Copper
    Material: Copper
    Size:100mmx100mm
    ( thickness 0.1/0.2/0.5/0.8/1mm based on your choice)
    Feature:
    -100% new and high quality.
    -Smooth surface, smooth edges and corners, no burr.
    -Has good electrical conductivity, thermal conductivity, corrosion resistance and processing properties, can be welded and brazing.
    -To improve the thermal conductivity of filler, applies to the graphics card and radiating module and conduction gap, reduce the repair rate card.
    -Applications: mobile phone, tablet, notebook CPU chip, North and South Bridge chip, memory chip, memory chips and card small chip, small chip hard all kinds of computer electronic chip auxiliary heat.
    Usage method:
    -Clean electronic components surface, to ensure that no greasy no debris, keep the surface dry, then tear to heat sink on the back of the built-in protective film, the heat sink careful viscosity on heat chip, slightly to ensure uniform force can be.
    Shipping
    And Handling Note
    Please note:
    1.Delivery time depends on destination and other factors: there maybe some delay due to flight, holiday, weather, local post, local natural disaster impact. if your shipment delays, we hope you can be patient, and at the same time contact us, we will try our best to help you.
    2.International buyers please note:
    a.Import duties, taxes and charges are not included in the item price or shipping charges. These charges are buyer’s responsibility. We will try our best to reduce the risk of the custom duties.
    b.Please check with your country's customs office to determine what these additional costs will be prior to buying.